Recently, Lam, a leader in semiconductor equipment, announced the launch of Coronus DX, the world's first edge deposition solution, designed to solve key process challenges in next-generation logic chips, 3D NAND and advanced packaging applications.
According to reports, Coronus DX can deposit a special protective film on the edge of the wafer, which can help reduce defects and damage that often occur in advanced semiconductor manufacturing and improve chip yield.
Sesha Varadarajan, vice president of Lam, said that Coronus DX helps to achieve predictable manufacturing and greatly improves yield. This technology can be used in the production of advanced chips, semiconductor packaging and 3D NAND memory chips, and reduce the cost of advanced process chips.